Role of contamination on the bondline integrity of composite structures
Author(s) -
Xu Shang
Publication year - 2013
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/1342569
Subject(s) - materials science , adhesive , composite material , joint (building) , welding , composite number , adhesive bonding , stiffness , structural engineering , layer (electronics) , engineering
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