Open AccessFinal Scientific/Technical Report (DOE F 241.3) Next-Generation LED Package Architectures Enabled by Thermally Conductive Transparent Encapsulants
Author(s) -
A. Murugaiah
Publication year - 2016
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/1337777
Subject(s) - materials science , boron nitride , thermal conductivity , thermal , composite material , phosphor , optoelectronics , nitride , thermal management of electronic devices and systems , mechanical engineering , layer (electronics) , physics , meteorology , engineering
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