
Microstructural Effects on Void Nucleation in Single-Phase Copper Polycrystals
Author(s) -
Evan Lieberman,
Ricardo A. Lebensohn,
Edward M. Kober,
Anthony D. Rollett
Publication year - 2015
Language(s) - English
Resource type - Reports
DOI - 10.2172/1183396
Subject(s) - grain boundary , materials science , nucleation , void (composites) , grain boundary strengthening , composite material , microstructure , thermodynamics , physics