Open AccessAn Elastic Plastic Contact Model with Strain Hardening for the LAMMPS Granular Package
Author(s) -
Bryan Kuhr,
Matthew R. W. Brake,
Jeremy B. Lechman
Publication year - 2015
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/1177388
Subject(s) - materials science , hardening (computing) , strain hardening exponent , composite material , layer (electronics)
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