Open AccessAutomated HMC assembly
Author(s) -
R.J. Blazek
Publication year - 1993
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/10186737
Subject(s) - wire bonding , materials science , integrated circuit , gallium arsenide , microwave , monolithic microwave integrated circuit , wedge (geometry) , printed circuit board , optoelectronics , electrical engineering , engineering , telecommunications , optics , amplifier , chip , physics , cmos
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