Open AccessAcid copper sulfate plating bath: Control of chloride and copper. Final report
Author(s) -
K. J. Borhani
Publication year - 1992
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/10169856
Subject(s) - copper , copper plating , chloride , electroplating , plating (geology) , copper chloride , sulfate , inorganic chemistry , electrode , chemistry , materials science , metallurgy , composite material , layer (electronics) , geophysics , geology
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