Open AccessProduction test IP-665-A, evaluation of hot-die-sized end bonding processes
Author(s) -
K.L. Hladek
Publication year - 1964
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/10146479
Subject(s) - die (integrated circuit) , diffusion , materials science , diffusion bonding , fabrication , process (computing) , nuclear engineering , composite material , engineering , computer science , nanotechnology , medicine , physics , alternative medicine , pathology , thermodynamics , operating system
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