Open AccessElucidating the role of interfacial materials properties in microfluidic packages.
Author(s) -
Thayne L. Edwards
Publication year - 2013
Language(s) - English
Resource type - Reports
DOI - 10.2172/1088068
Subject(s) - multiphysics , welding , materials science , adhesive , microfluidics , finite element method , mechanical engineering , ultrasonic sensor , material properties , adhesive bonding , computer science , composite material , structural engineering , nanotechnology , acoustics , layer (electronics) , engineering , physics
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