Open AccessInfluence of Cu Addition on the Transient Creep Characteristics of Sn–9Zn-1.5Ag Solder Alloy
Author(s) -
M. Y. Salem
Publication year - 2020
Publication title -
american research journal of physics
Language(s) - English
Resource type - Journals
ISSN - 2380-5714
DOI - 10.21694/2380-5714.20001
Subject(s) - creep , soldering , materials science , alloy , transient (computer programming) , metallurgy , composite material , computer science , operating system
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