
A Study on the the calculation of the linear thermal transmittance of wall-window joint based on infrared thermography
Author(s) -
JeongSeok Choi,
Byung-Ki Jeon,
Seung hoon Park,
Eui-Jong Kim
Publication year - 2020
Publication title -
proceedings of the 2020 international conference on quantitative infrared thermography
Language(s) - English
Resource type - Conference proceedings
DOI - 10.21611/qirt.2020.052
Subject(s) - thermography , window (computing) , transmittance , infrared , joint (building) , materials science , thermal , infrared window , optics , thermal transmittance , computer science , structural engineering , optoelectronics , physics , thermal resistance , engineering , meteorology , operating system