Open AccessReliability Testing on the Printed Circuit Board of Mobile Phone using Infrared Thermography
Author(s) -
Hoon Joo,
WonTae Kim,
MoonHee Choi
Publication year - 2006
Language(s) - English
Resource type - Conference proceedings
DOI - 10.21611/qirt.2006.100
Subject(s) - thermography , printed circuit board , reliability (semiconductor) , mobile phone , infrared , circuit reliability , reliability engineering , computer science , on board , engineering , electrical engineering , telecommunications , optics , aerospace engineering , power (physics) , physics , quantum mechanics