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Strength Characterisation of Nanochemical Stabilized Kuttanad Clay for Pavement Construction
Author(s) -
Regi P. Mohan,
P Adarsh
Publication year - 2021
Publication title -
aijr proceedings
Language(s) - English
Resource type - Conference proceedings
ISSN - 2582-3922
DOI - 10.21467/proceedings.112.17
Subject(s) - california bearing ratio , lime , compressive strength , soil stabilization , cement , curing (chemistry) , water content , environmental science , fly ash , settlement (finance) , bearing capacity , materials science , geotechnical engineering , moisture , soil water , composite material , geology , soil science , computer science , world wide web , payment , metallurgy
Kuttanad clays are low strength, soft, organic clay deposits found in the Kuttanad areas of the Alappuzha district, Kerala. Lots of failures have been reported to the structures built over it due to its swelling - shrinking characteristics. To enhance the load-bearing capacity and decrease the settlement characteristics, the addition of appropriate stabilizing agents is considered the most efficient technique in soil stabilization applications. Soil stabilization techniques using traditional stabilizers in mass projects have become costly due to the increase in the cost of materials like cement, lime, fly ash, etc. Moreover, cement production also accounts for global warming due to the emission of carbon gas. Hence studies are going on regarding the effectiveness of using non-traditional materials that can react faster as stabilizing agents and thus reducing the cost of construction. This paper focuses on studying the suitability of a non-traditional nanotechnology-based organo-silane compound in the treatment of Kuttanad clay soils. Observations were made for the variation in the strength characteristics of the soil such as maximum dry density, optimum moisture content, Unconfined Compressive Strength (UCS), California Bearing Ratio (CBR) strength of samples stabilized with varying dosages of nanochemical for curing periods up to 28days.

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