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Digital Image Correlation Procedure to Characterize Soil Surface Layer Cracking
Author(s) -
CaárdenasGarcía Jaime F.,
Yao Haigen,
Zheng Siding,
Zartman Richard E
Publication year - 1998
Publication title -
agronomy journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.752
H-Index - 131
eISSN - 1435-0645
pISSN - 0002-1962
DOI - 10.2134/agronj1998.00021962009000030019x
Subject(s) - vertisol , digital image correlation , displacement (psychology) , cracking , surface (topology) , soil science , surface layer , sample (material) , geology , soil water , mathematics , mineralogy , layer (electronics) , materials science , geometry , chemistry , composite material , chromatography , psychology , psychotherapist
This study was conducted to characterize surface layer cracking in Vertisols by determining surface displacement trends. A disturbed sample from the Ap horizon of a Randall clay (fine, smectitic, thermic Ustic Epiaquerts) was evaluated. Digital image correlation (DIC) used to track the movement of points on the surface as the soil dried and to assess the development of soil surface cracking. Displacement fields among a group of images were obtained by using a cross‐correlation algorithm. The displacement vectors resulting from the analysis of the displaced fields can be used to show cracking patterns on a ground‐up soil sample from a Vertisol before they become visually apparent. Digital image correlation may be used to calculate the deformation of the surface layer with relatively high precision.