ADDITIONAL INSULATION MATERIALS IN A WINDOW FRAME: EXPERIMENTAL AND CFD ANALYSES
Author(s) -
Piotr Koper,
Marta JANKOWSKA
Publication year - 2019
Publication title -
architecture civil engineering environment
Language(s) - English
Resource type - Journals
eISSN - 2720-6947
pISSN - 1899-0142
DOI - 10.21307/acee-2019-031
Subject(s) - heat flux , materials science , window (computing) , computational fluid dynamics , thermal insulation , aerogel , frame (networking) , composite material , flux (metallurgy) , thermal , drop (telecommunication) , mechanical engineering , mechanics , heat transfer , engineering , layer (electronics) , computer science , thermodynamics , physics , metallurgy , operating system
During our research, we tested how addition of insulating material inside a PCV window profile affects improvement of its thermal insulation. The tested insulation types were: PIR board, aerogel mat, and 3D printed additional profiles. The analysis of the heat flux passing through the window frame was carried out using the authors’ methodics, based on measurements of the temperature distribution in operating conditions and CDF simulations. The heat flux passing through the profile is calculated numerically, and the results of measurements are used to validate the accuracy of these simulations. For all the tested cases, simulations accurately reproduced the results of measurements. The heat flux drop compared to unmodified profile was about 9.8% for aerogel mat, 6.9% for PIR board, and 4.3% for 3D printed elements.
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