Open AccessA new design proposal and thermal analysis of subassemblies inside a satellite
Author(s) -
S Drăghici
Publication year - 2019
Publication title -
scientific bulletin
Language(s) - English
Resource type - Journals
eISSN - 2392-8956
pISSN - 1454-864X
DOI - 10.21279/1454-864x-19-i1-043
Subject(s) - satellite , payload (computing) , thermal , orbit (dynamics) , aerospace engineering , electronics , finite element method , engineering , mechanical engineering , computer science , structural engineering , meteorology , electrical engineering , physics , computer network , network packet
On this study the authors aim to validate the use of CFRP composites in a subassembly of a satellite as a replacement for currently used aluminum. Considering the high costs of sending a mass unit of payload into orbit, the mass should be minimized. Therefore, the application of composite materials in electronics housing structures was proposed. For this, a new design is proposed and a comparative thermal analysis of the two boxes is made. Present study focusses on a subassembly’s surfaces and materials of a satellite structure subject to thermal variations in order to numerricaly validate the new design. A satellite electronic housing was subject to a three-dimensional finite element analysis. The satellite’s thermal loading in an orbit of sun-tracking mode are partially transfered to the electronic housing inside. A model is developed and the temperature distribution in the satellite subassembly predicted using empirical available data. Based on the numerical results conclusion and discutions are drawn.