Open AccessDiffusion Bonding Material Tungsten-Baja dengan Interlayer Ag-4% Cu
Author(s) -
Sirod Hantoro,
Tiwan Tiwan
Publication year - 2005
Publication title -
teknoin
Language(s) - Romanian
Resource type - Journals
eISSN - 2655-6529
pISSN - 0853-8697
DOI - 10.20885/teknoin.vol10.iss1.art5
Subject(s) - materials science , tungsten , microstructure , diffusion bonding , shear strength (soil) , composite material , shear (geology) , thermal diffusivity , grain boundary diffusion coefficient , grain boundary , metallurgy , thermodynamics , environmental science , soil water , physics , soil science
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