
Polishing of precision parts of optical-electronic and laser equipment
Author(s) -
O. Y. Yurchyshyn,
Yurii Filatov,
V. I. Sidorko,
В.А. Ковальов
Publication year - 2021
Publication title -
progresivna tehnìka, tehnologìâ ta ìnženerna osvìta
Language(s) - English
Resource type - Journals
ISSN - 2409-7160
DOI - 10.20535/2409-7160.2021.xxii.238979
Subject(s) - polishing , materials science , surface roughness , abrasive , wafer , composite material , nanotechnology
The mechanism of interaction of the optical surface with the polishing dispersed system during polishing is investigated. It is established that the energy transfer between them is a consequence of the dipole-dipole interaction in the donor-acceptor system and occurs by the Ferster mechanism. It was found that the decrease in the spectral separation between the treated material and the particles of polishing powder causes an increase in the size of sludge particles and wear particles, which leads to an increase in the roughness parameters Ra, Rq, Rmax of optical surfaces during polishing by polishing dispersed sys-tems. It is shown that the polishing productivity of optical surfaces and the wear intensity of polishing powder particles decrease with increasing corresponding transfer energies, which confirms the main pro-visions of the cluster theory of polishing of nonmetallic materials and the validity of quantum mechanical description of resonant energy transfer mechanism between dispersed material and dispersed system.