Open AccessReliable metal alloy contact for Mg3+δBi1.5Sb0.5 thermoelectric devices
Author(s) -
Shaowei Song,
Zhongxin Liang,
Congcong Xu,
Yu Wang,
Xin Shi,
Wuyang Ren,
Zhifeng Ren
Publication year - 2022
Publication title -
soft science
Language(s) - Uncategorized
Resource type - Journals
ISSN - 2769-5441
DOI - 10.20517/ss.2022.11
Subject(s) - materials science , ohmic contact , thermoelectric effect , contact resistance , alloy , thermoelectric materials , electrical resistivity and conductivity , condensed matter physics , metallurgy , nanotechnology , thermal conductivity , thermodynamics , composite material , electrical engineering , physics , engineering , layer (electronics)