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AMOLED displays with transfer‐printed integrated circuits
Author(s) -
Cok Ronald S.,
Hamer John W.,
Bower Christopher A.,
Menard Etienne,
Bonafede Salvatore
Publication year - 2011
Publication title -
journal of the society for information display
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.578
H-Index - 52
eISSN - 1938-3657
pISSN - 1071-0922
DOI - 10.1889/jsid19.4.335
Subject(s) - amoled , oled , active matrix , materials science , transfer printing , optoelectronics , substrate (aquarium) , electronic circuit , integrated circuit , silicon , nanotechnology , electrical engineering , thin film transistor , oceanography , engineering , layer (electronics) , geology , composite material
— Small integrated circuits of crystalline silicon (chiplets) transfer‐printed onto a flat‐panel‐display substrate provide greatly improved electrical performance and uniformity in active‐matrix organic light‐emitting‐diode (OLED) displays. The integrated circuits are formed in high‐performance crystalline silicon using conventional photolithographic processes and then transfer‐printed onto a substrate using a stamp that transfers hundreds or thousands of chiplets at once. The chiplets are connected to an external controller and to pixel elements using conventional photolithographic substrate processing methods. Active‐matrix OLED (AMOLED) displays using transfer‐printed chiplets have good yields, excellent uniformity, and electrical performance and are thermally robust.