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52.2: Edge‐Type LED Module Mura Analysis and Improvement
Author(s) -
Huang ChiChen,
Yang HungLing,
Tzeng Alex
Publication year - 2011
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.3621439
Subject(s) - mura , enhanced data rates for gsm evolution , computer science , thermal , finite element method , software , type (biology) , structural engineering , engineering , artificial intelligence , liquid crystal display , physics , geology , meteorology , programming language , operating system , paleontology
The root cause of thermal mura which often occurs at edge‐type LED module is analyzed. A corresponding simulation method of how to predict thermal mura is proposed in this study. The method combines thermal analysis software (finite volume calculation method), structure analysis software (finite element calculation method) and photo‐elastic theory. In the meantime, experimental result of thermal mura of advanced study can be well explained by the proposed simulation method. We find that the proposed simulation method can provide an effective and comprehensive evaluation for thermal mura. Finally, we use this simulation method to find out some right directions to improve mura phenomenon in edge‐type LED module.