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P‐106: Thermo‐mechanical Analysis of HB‐LED at Low Temperature
Author(s) -
Ji Peng Fei,
Bang YoungTae,
Kim ByungHo,
Moon CheolHee
Publication year - 2011
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.3621142
Subject(s) - reliability (semiconductor) , stress (linguistics) , finite element method , materials science , thermal , mechanical engineering , composite material , structural engineering , engineering , thermodynamics , physics , linguistics , philosophy , power (physics)
The paper researches the reliability of HB‐LED by investigating thermal stress and thermo‐mechanical stress through FEM software. After verifying the accuracy of simulation model by steady state measurement, thermo‐mechanical stress would be simulated to investigate the failure mechanism of HB‐LED at low temperature.