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P‐66: Wet Chemical Metallization for High‐End Flat Panel Display Manufacturing
Author(s) -
Bamberg Simon,
Beck Birgit,
Brüggmann Horst,
Brüning Frank,
Langhammer Elisa,
Lowinski Christian,
Merschky Michael,
Schulze Jörg,
Etzkorn Johannes
Publication year - 2011
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.3621091
Subject(s) - flat panel display , thin film transistor , copper , materials science , flat panel , plasma display , conductor , sputtering , surface finish , transistor , conductivity , surface roughness , optoelectronics , deposition (geology) , flat surface , composite material , metallurgy , electrode , thin film , nanotechnology , electrical engineering , layer (electronics) , computer science , engineering , chemistry , voltage , computer graphics (images) , paleontology , sediment , biology
Recently the use of Copper as a conductor material for Thin Film Transistor (TFT) structures has received increasing attention in the Flat Panel Display industry [1, 2]. Since sputtering of thick Cu layers has serious disadvantages Flat Panel Display (FPD) manufacturers are considering wet chemical Cu deposition as a viable process alternative. Depending on the required film properties like conductivity and surface roughness either electroless or electrolytical Copper deposition can be applied.