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P‐78: DOE Approach to Elimination of Display Mura Induced by LGP Warpage in HTHH Environment
Author(s) -
Hsu HsuHung,
Lin MaoHsing,
Huang KunFeng
Publication year - 2010
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.3500004
Subject(s) - mura , image warping , humidity , automotive engineering , computer science , engineering , liquid crystal display , artificial intelligence , physics , thermodynamics , operating system
In this article, the mura issue of LCD panel induced by LGP warpage in high temperature and high humidity (HTHH) environment is discussed. From experiments, it is validated that insufficient gap between LGP and plastic mold frame, housing, will lead to deform the LGP. Due to the LGP has high moisture absorption and low thermal stability characteristics, it is easy to have volume expansion occurred. Obviously, the elongation of LGP will compress housing, thus LGP warping causes mura while panel in display mode. Experimental design (DOE) method is thus performed to generate a mathematical model to predict the displacement of LGP caused by hygrothermal effect. Finally, from experiment results, it is approved that the mura phenomenon has been eliminated. Furthermore, the mathematical construction model can provide the suitable design tolerance in module design phase.