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56.1: A Novel Composite Bump Design for Chip‐On‐Glass Package Using Non‐Conductive Adhesive Film
Author(s) -
Tang PaoYun,
Sun WeiHao,
Yang KeiHsiung
Publication year - 2009
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.3256923
Subject(s) - cog , materials science , adhesive , composite number , flip chip , electrical conductor , composite material , chip , process (computing) , computer science , electrical engineering , engineering , layer (electronics) , artificial intelligence , operating system
A novel composite bump, Smart bump, structure has been successfully developed for chip‐on‐glass (COG) package using non‐conductive adhesive film (NCF). We have successfully verified the low contact resistance and high reliabilities using Smart bump and COG NCF process for the packages of 17 “W, 12.1” and 2.4 “TFT‐LCD modules. We have realized that COG NCF process with Smart bump is simpler and lower cost in consumable materials than the conventional COG ACF process with Au bump. The COG NCF process also allows fine‐pitch‐driver package for high‐resolution TFT‐LCDs, and has a higher process yield in pilot production.