Premium
16.4: Ultra‐Thin Chip Packaging (UTCP): A Promising Technology for Future Flexible Display Interconnection
Author(s) -
Govaerts Jonathan,
Christiaens Wim,
Vanfleteren Jan
Publication year - 2009
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.3256741
Subject(s) - interconnection , electronics , limiting , chip , packaging engineering , computer science , flexible display , embedded system , engineering , electrical engineering , materials science , telecommunications , nanotechnology , mechanical engineering , thin film transistor , layer (electronics)
With several flexible display technologies sprouting up, the driving electronics seem to become the limiting factors in the bendability of any flexible display system. The idea of adapting existing interconnection technologies is discussed. Finally, ultra‐thin chip packaging is proposed to bypass this limitation imposed by the rigidity of the driver electronics.