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P‐184L: Late‐News Poster : Transient Thermal Stress Modeling of the Laser Frit Sealing Process
Author(s) -
Gu Yabei,
Powell William R.,
Zhang Lu,
Widjaja Sujanto,
Vaddi Butchi R.
Publication year - 2009
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.3256549
Subject(s) - frit , transient (computer programming) , seal (emblem) , materials science , thermal , stress (linguistics) , process (computing) , laser , finite element method , mechanical engineering , composite material , structural engineering , engineering , computer science , optics , thermodynamics , physics , art , visual arts , linguistics , philosophy , operating system
The frit laser sealing process has been modeled through the finite element method. Transient thermal stress results have been used to explain experimental observations, and to provide further processing recommendations and design guidelines. The results explained why high CTE glass is hard to seal. A simple and practical solution is demonstrated to reduce the transient thermal stress by elevating ambient temperature during high CTE glass sealing.