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10.4: Multi‐Wavelength Photolithography for Manufacturing Flexible Electronics
Author(s) -
Jain Ajay,
Powch George
Publication year - 2009
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.3256473
Subject(s) - photolithography , masking (illustration) , photoresist , materials science , electronics , capital equipment , nanotechnology , optoelectronics , computer science , manufacturing engineering , engineering , electrical engineering , layer (electronics) , art , visual arts
Abstract A novel method of intrinsically self‐aligned photolithography is presented for cost effective manufacturing of polysilicon AM TFT arrays with integrated drivers on large area, flexible substrates, suitable for eventual R2R processes. Multiple patterns are exposed simultaneously into multi‐wavelength sensitive photoresist layers, where all critical coatings have been pre‐deposited, fully obviating repetitive masking steps. The method can significantly reduce processing time and the associated capital costs while increasing quality and yield. Approved for Public Release, Distribution Unlimited (DISTAR 12639)