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P‐117: Analysis for LED Junction Temperature in LCD Module Based on Numerical Simulation
Author(s) -
Chen YungKan,
Lin MaoHsing,
Huang KunFeng
Publication year - 2008
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.3069478
Subject(s) - backlight , liquid crystal display , junction temperature , light emitting diode , optoelectronics , materials science , diode , voltage , electrical engineering , thermal , engineering , physics , meteorology
In this paper, we discuss the junction temperature of LED in the LCD module. The lifetime of LED strongly depends on the junction temperature. Besides, the optical performance of LED will decay with the rise of junction temperature. Mura of LCD module may occur due to non‐uniform decay of the LEDs, which are the light sources of LCD module. Besides forward current and voltage, package material, PCB and LCD module design will also affect the LED junction temperature. By using numerical analysis, we can understand the parameters that strongly affect the LED junction and improve the quality of LCD with LED backlight. Lead frame material of LED package, dielectric layer of the PCB, and the back cover of LCD module are discussed in this paper to have a good thermal performance of the LCD module with LED backlight.