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P‐71: Substrate Adhesion Technique Using Thermosetting Resin to Apply Roll‐to‐Roll Process to Manufacturing of LCDs
Author(s) -
Gwag JinSeog,
Han InYung,
Bae KwangSoo,
Choi Hong,
Sohn Kyunghwa,
Kim JaeHoon
Publication year - 2008
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.3069426
Subject(s) - thermosetting polymer , materials science , process (computing) , substrate (aquarium) , tetrahydrofuran , adhesion , composite material , roll to roll processing , computer science , chemistry , organic chemistry , solvent , geology , operating system , oceanography
We developed novel substrate adhesion technique using thermosetting resin to apply roll‐to‐roll process to manufacturing of LCDs. We can use one‐drop‐filling (ODF) process without any distortion of LC alignment using the mixture of thermosetting resin and tetrahydrofuran(THF). This technique can be used to roll‐to‐roll process for flexible LCDs.