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Interconnecting drivers to flexible displays
Author(s) -
Govaerts Jonathan,
Vandecasteele Bjorn,
Vanfleteren Jan
Publication year - 2008
Publication title -
journal of the society for information display
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.578
H-Index - 52
eISSN - 1938-3657
pISSN - 1071-0922
DOI - 10.1889/1.2953484
Subject(s) - interconnection , polyimide , materials science , substrate (aquarium) , adhesive , polyethylene terephthalate , flip chip , process (computing) , electrical conductor , chip , computer science , flexible display , optoelectronics , nanotechnology , composite material , layer (electronics) , telecommunications , thin film transistor , oceanography , geology , operating system
— Several options to interconnect driver chips to a flexible display are discussed and investigated. In the first option, bare test dies are flip‐chip (FC) assembled onto polyethylene terephthalate (PET) display substrates. The second option involves test flexible polyimide (PI) substrates, imitating tape‐carrier‐packaged drivers (TCP), bonded onto the same PET substrates, whereas the third option uses actual TCPs on stainless‐steel display substrates. Each option makes use of bonding technology with anisotropically conductive adhesive, supplied as film (ACF). The reason for using ACF is that drivers typically have high output counts, and therefore very fine pad features, 200‐μm pitch and below. The technology has been adapted for each option, considering the requirements of the substrate. Every option includes an explanation of the bond test setup, the bonding process itself, and a discussion of the test results. The conclusion summarizes the achievements made in the research reported in this article.