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65.3: Intrinsic Patterning Principle on Array Repair Using “Laser Metal Transfer”
Author(s) -
Kojima Eisaku,
Wada Takehiko
Publication year - 2007
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.2785679
Subject(s) - laser , transfer (computing) , line width , materials science , line (geometry) , optoelectronics , solid state , feature (linguistics) , metal , optics , computer science , engineering , engineering physics , mathematics , physics , geometry , metallurgy , linguistics , philosophy , parallel computing
As alternative technology for flat panel wiring repair, the new method has been developed by solid state metal transfer using pulsed infra‐red laser. This technology realizes about 10 times faster and half cost manufacturing processes than usual laser CVD. And it also realizes in‐line wiring repair with its aspect feature of min 2μm width / 0.3 μm height pattern of arbitrary length.