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54.1: LED Packaging by Ink‐jet Microdeposition of High‐Viscosity Resin and Phosphor Dispersion
Author(s) -
Amemiya Isao,
Nomura Yuko,
Mori Kenichi,
Yoda Miho,
Takasu Isao,
Uchikoga Shuichi
Publication year - 2007
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.2785626
Subject(s) - materials science , inkwell , phosphor , light emitting diode , fabrication , nozzle , optoelectronics , composite material , viscosity , jet (fluid) , optics , medicine , alternative medicine , physics , pathology , thermodynamics
The applicability of an ink‐jet printing method to microdeposition of high‐viscosity resin and phosphor dispersion for light‐emitting‐diode (LED) packaging was examined for the first time. An ultrasonic ink‐jet printing method was used, in which ink droplets are ejected by focused ultrasonic beam from nozzle‐less printhead. for fabricating white LEDs, high‐viscosity phosphor‐dispersed resin was deposited to form an encapsulant dome, and hydrophobic surface treatment of the lead frame substrate enabled fabrication of a small encapsulant dome to improve color uniformity. A silicone microlens was deposited on an encapsulant dome using the ink‐jet method for light directivity control. The results show the ultrasonic ink‐jet printing is an applicable technique to optimize and modify on demand optical characteristics of the LED devices.