Premium
34.4: Investigation of Image Sticking By Using 3D‐ FEM Simulation for VA Mode LCD
Author(s) -
Liu YenChi,
Chou KuoChing
Publication year - 2007
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.2785539
Subject(s) - finite element method , feedthrough , software , liquid crystal display , image (mathematics) , disclination , type (biology) , simulation software , process (computing) , materials science , energy (signal processing) , voltage , structural engineering , computer science , optoelectronics , engineering , physics , computer vision , liquid crystal , electrical engineering , geology , paleontology , quantum mechanics , programming language , operating system
By using 3D‐FEM simulation software, the V‐T curves associated with the disclination line appeared in both CC‐type and TT‐type cell were investigated. Experiment results reveal that the ΔV p (feedthrough voltage) of CC‐types is larger than that of TT‐types, the image sticking phenomena will be easily detected for CC‐type design. Besides the influence on the image sticking for various anchoring energy and alignment layer thickness has also been studied through simulation software, an optimum process range can be acquired.