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Flexible microelectronics becoming a reality with Suftla transfer technology
Author(s) -
Miyasaka Mitsutoshi
Publication year - 2007
Publication title -
journal of the society for information display
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.578
H-Index - 52
eISSN - 1938-3657
pISSN - 1071-0922
DOI - 10.1889/1.2759553
Subject(s) - microelectronics , thin film transistor , polycrystalline silicon , transistor , materials science , computer science , electronic circuit , substrate (aquarium) , silicon , polysilicon depletion effect , electrical engineering , engineering physics , optoelectronics , nanotechnology , engineering , oceanography , layer (electronics) , gate oxide , voltage , geology
Abstract— Suftla is a technology that is used to transfer polycrystalline silicon (polysilicon) thin‐film‐transistor (TFT) circuits from an original glass substrate to a plastic sheet. The electronic devices in the next generation will be thin, lightweight, and will handle huge amounts of data, yet consume less energy. Suftla technology, together with high‐performance polysilicon TFTs, meets all these requirements because we have developed a variety of smart flexible electronic devices, such as thin paperback‐sized displays and microprocessors. Suftla will usher in a new era of life‐enhancing flexible microelectronics.