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Digital lithographic processing for large‐area electronics
Author(s) -
Wong William S.,
Chabinyc Michael L.,
Limb Scott,
Ready Steven E.,
Lujan René,
Daniel Jurgen,
Street Robert A.
Publication year - 2007
Publication title -
journal of the society for information display
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.578
H-Index - 52
eISSN - 1938-3657
pISSN - 1071-0922
DOI - 10.1889/1.2759551
Subject(s) - lithography , photolithography , materials science , backplane , thin film transistor , digital light processing , color gel , electronics , layer (electronics) , printed electronics , active matrix , optoelectronics , optics , computer science , nanotechnology , inkwell , electrical engineering , computer hardware , engineering , artificial intelligence , projector , physics , composite material
— A non‐contact jet‐printed mask‐patterning process is described. By combining digital imaging with jet printing, digital lithography was used to pattern a‐Si:H‐based electronics on glass and plastic substrates in place of conventional photolithography. This digital lithographic process is capable of layer‐to‐layer registration of ±5 μm using electronic mask files that are directly jet printed onto a surface. Aminimum feature size of 50 μm was used to create 180 × 180 element backplanes having 75‐dpi resolution for display and image‐sensor applications. By using a secondary mask process, the minimum feature size can be reduced down to ∼15 μm for fabrication of short‐channel thin‐film transistors. The same process was also used to pattern black‐matrix wells in fabricating color‐filter top plates in LCD panels.

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