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65.3: Quantitative Adhesion Analysis of Sputtered Copper Films on Glass Substrate by Microindentation Measurement
Author(s) -
Lai ChinChuan,
Chiu HsienKun,
Lin YiPen,
Kuan YungChia,
Sun Oliver
Publication year - 2006
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.2433413
Subject(s) - copper , materials science , adhesion , substrate (aquarium) , composite material , metallurgy , geology , oceanography
Quantitative adhesion testing of copper films on glass substrates was investigated by microindentation measurement. Due to the weak adhesion and inter‐diffusion issues between copper (Cu) and glass substrates, we deposited silicon nitride (SiNx) films on glass substrates initially. Optimizing Cu sputtering parameters and introducing ammonia (NH 3 ) plasma treatment onto SiNx, we obtained the superior adhesion strength of Cu/SiNx/glass structures. Based on the values of critical reduced depth (b) with Cu/SiNx/glass (b=1.311) and with Cu/Mo/glass (b=1.005) structures, we inferred that the adhesion strength of these two kinds of structures was almost the same. Furthermore, the etching profiles of Cu/SiNx structures were excellent. The taper angle was approximately 60 degrees, and critical‐dimension loss percent was about 7.