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57.4: Distinguished Paper : A Novel Hermetic‐Sealing Material for FED
Author(s) -
Ishizeki Kenji,
Kuroki Yuichi,
Ueki Mikio,
Sugawara Tsunehiko,
Yamazaki Akihiro,
Itou Yuichi,
Fujii Yasuhisa
Publication year - 2006
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.2433376
Subject(s) - thermosetting polymer , seal (emblem) , materials science , polyimide , filler (materials) , composite material , layer (electronics) , art , visual arts
Abstract A hermetic‐sealing material for FED composed of thermosetting polyimide and inorganic filler has been developed. This material enables us to seal at a temperature around 350 °C in nitrogen atmosphere and shows superior performance suitable for glass‐to‐glass and glass‐to‐metal sealing.