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P‐67: Chip on Glass Bonding Using StressedMetal™ Technology
Author(s) -
Fork David K.,
Chow Eugene M.,
Chua Christopher L.,
Hantschel Thomas,
Schuylenbergh Koenraad,
Jagerson Ty,
Wong Lai,
Geluz Vicki
Publication year - 2005
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.2036493
Subject(s) - materials science , adhesive , chip , composite material , electrical conductor , flip chip , daisy chain , optoelectronics , computer science , computer hardware , electrical engineering , engineering , layer (electronics)
Chip‐on‐glass (COG) interconnections require finer pitch to handle denser displays with more integrated driver chips, particularly for mobile devices. We report recent developments utilizing tiny micro‐machined springs to replace ACF (anisotropic conductive film). Liquid, ultraviolet light‐cured adhesives permit the attachment of chips to the glass without heating. We fabricated and tested daisy chain test vehicles with 800 spring contacts on 20 μm pitch.