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63.1: Flip Chip Assembly of Panel‐Sized TFT‐LCD Scan Drivers with Electroless‐Plated Bumps Using Anisotropic Conductive Films
Author(s) -
Noda Shunji,
Toba Tamaki,
Hayama Hiroshi
Publication year - 2005
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.2036364
Subject(s) - flip chip , materials science , liquid crystal display , thin film transistor , electrical conductor , chip , optoelectronics , composite material , electrical engineering , engineering , layer (electronics) , adhesive
We have successfully assembled Panel‐sized TFT‐LCD scan drivers on LCD panels using Anisotropic Conductive Films, and have demonstrated 12.1″ diagonal defect free XGA TFT‐LCDs. We have also confirmed a good reliability of the driver assembly.
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