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34.1: Ultra‐Thin Encapsulation for Large‐Area OLED Displays
Author(s) -
Rosink J. J. W. M.,
Lifka H.,
Rietjens G. H.,
Pierik A.
Publication year - 2005
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.2036236
Subject(s) - oled , materials science , stack (abstract data type) , optoelectronics , encapsulation (networking) , silicon , thin film , silicon nitride , silicon oxide , moisture , layer (electronics) , nanotechnology , composite material , computer science , computer network , programming language
Abstract Organic light emitting displays (OLEDs) can be made as thin as the substrate if thin film packaging is used. We have developed an effective encapsulation method for OLED displays, based on a multi‐stack approach of silicon‐nitride (N) and silicon‐oxide (O) PECVD films as a barrier layer. We present results on the moisture resistance properties of this stack. The water permeability of a NONON stack was measured in the range of 10 −6 g/m 2 ⋅day.