Low‐cost display assembly and interconnect using ink‐jet printing technology | Zendy

Hayes Donald J. | Zendy; Cox W. Royall | Zendy; Grove Michael E. | Zendy

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Low‐cost display assembly and interconnect using ink‐jet printing technology

Author(s) -

Hayes Donald J.,

Cox W. Royall,

Grove Michael E.

Publication year - 2001

Publication title -

journal of the society for information display

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.578

H-Index - 52

eISSN - 1938-3657

pISSN - 1071-0922

DOI - 10.1889/1.1844664

Subject(s) - interconnection , materials science , inkwell , liquid crystal display , adhesive , color gel , 3d printing , soldering , filter (signal processing) , jet (fluid) , viewing angle , screen printing , manufacturing cost , computer science , optoelectronics , nanotechnology , composite material , mechanical engineering , computer vision , telecommunications , engineering , layer (electronics) , aerospace engineering , thin film transistor

— Ink‐jet printing methods may be utilized for efficient micro‐deposition of solder bumps, spacer balls, and adhesive sealant/bond lines, as well as liquid‐crystal and color‐filter droplets, in the manufacture of display panels. Advantages realized by this approach include data‐driven low‐cost high‐speed non‐contact environmentally friendly processing.

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