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38.2: Application of FEM Residual Stress Analysis to Solve Breakage Problems in CRT Makers' Frit‐sealing Process
Author(s) -
Imura Yuki,
Watanabe Yuichi
Publication year - 2000
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.1833112
Subject(s) - breakage , frit , finite element method , residual stress , diagonal , materials science , process (computing) , stress (linguistics) , enhanced data rates for gsm evolution , structural engineering , mechanical engineering , composite material , computer science , engineering , mathematics , geometry , telecommunications , linguistics , philosophy , operating system
Breakage's at the diagonal outside edge of flat panels occured during the CRT makers' frit‐sealing process. One of the methods used to solve this problem was the FEM (Finite Element Method) analysis of residual stresses to determine which cooling conditions would produce an optimum stress distribution during the glass makers' forming process. The data was applied to the actual cooling process, resulting in reduced incidences of frit‐sealing process breakage's