Premium
P‐40: New Vacuum Packaging Using Wire‐Heater and Optical Fiber Spacer for FED
Author(s) -
Lee DuckJung,
Ju ByeongKwon,
Lee YunHi,
Oh MyungHwan,
Jang Jin
Publication year - 2000
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.1833039
Subject(s) - frit , materials science , getter , optical fiber , flat panel , composite material , optoelectronics , optics , physics
We suggested a new FED packaging technology using the localized heating method of glass frit and a high aspect ratio spacer formation technology using the optical fibers. A nickel wire heater of 300 μm diameter was used to melt the glass frit and to activate a getter. The FED panel was vacuum packaged in 230 °C by applying current to wire. The optical fiber spacer of 100 μm diameter was built to 300 μm as mesh type. Through the leakage test, we confirmed that the panel was hermetic sealed. As a result, the electron emission was successfully obtained in 1.25‐inch packaged FED panel.