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P‐21: Novel Interconnect Technology for Microdisplays
Author(s) -
Gronauer Volker,
Schricker Ulrich,
Cockey Scott
Publication year - 2000
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.1833018
Subject(s) - interconnection , key (lock) , throughput , computer science , telecommunications , operating system , wireless
Challenges for companies engaged in the business of manufacturing microdisplays include the lack of flexible, low cost, high throughput interconnect solutions. The successful resolution of this will be explored and key areas of concern will be addressed with the introduction of a new fine‐pitch, variable length/width wirebondable cable.