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19.2: Development of a Chip Bonding Technology for Plastic Film LCDs
Author(s) -
Park S. K.,
Han J. I.,
Kim W. K.,
Kwak M. K.
Publication year - 2000
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.1832935
Subject(s) - interconnection , materials science , composite material , thermal conduction , plastic film , optoelectronics , computer science , telecommunications , layer (electronics)
A new technology realizing reliable interconnection between Plastic Film LCDs panel and a driving circuit was developed under the stepped processing condition of low temperature and pressure with ACFs for Plastic Film LCDs. The conduction failure of interconnection between the two resulted from elasticity, low thermal resistance and high thermal expansion of plastic film substrates. Conductive particles with elasticity similar to that of the plastic film substrate did not damage an ITO electrode on plastic film substrates, and low temperature and pressure in a stepped process also did not deform the surface of plastic film substrates. As a result highly reliable interconnection with minimum contact resistance was accomplished.