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P‐93: Reliability Performance for Microencapsulated Electrophoretic Displays with Simulated Active Matrix Drive
Author(s) -
Danner G. M.,
Atkinson J.,
Duvally R.,
Ewing J.
Publication year - 2003
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.1832340
Subject(s) - active matrix , reliability (semiconductor) , matrix (chemical analysis) , simple (philosophy) , pixel , electronics , computer science , electronic engineering , materials science , engineering , nanotechnology , electrical engineering , artificial intelligence , composite material , physics , thin film transistor , power (physics) , philosophy , epistemology , layer (electronics) , quantum mechanics
We describe experiments using a simple test structure for examining microencapsulated electrophoretic films. The test panel construction reproduces the essential details of a manufactured display panel, and specially designed electronics reproduce an active matrix waveform on the test pixels. We report on results using this test panel for thermal stress tests targeting reliability requirements for handheld device applications.