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P‐68: Numerical Modeling of Heat Flow, Deformation and Stress in PDP Module
Author(s) -
Kim D.S.,
Shin K.S.,
Park J.K.
Publication year - 2003
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.1832316
Subject(s) - deformation (meteorology) , plasma display , heat transfer , flow (mathematics) , heat flow , inverse , stress (linguistics) , materials science , quality (philosophy) , computer science , mechanics , mechanical engineering , thermal , thermodynamics , engineering , composite material , mathematics , physics , geometry , linguistics , philosophy , electrode , quantum mechanics
Predictive modeling schemes have been developed to characterize the heat transfer and thermo‐mechanical behavior for the plasma display panel PDP in operation. The inverse approach was adopted to predict the accurate temperature distribution and deformation in PDP. The predictive models were validated with the measurements from real panel. The developed models could be utilized to predict and/or improve the product quality of PDP.