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P‐116: A Hybrid Encapsulation Method for OLED
Author(s) -
Yi C. H.,
Lee Y. K.,
Lee S. M.,
Ju S. H.,
Lee E. J.,
Choo Y. M.,
Park K. C.,
Jang J.
Publication year - 2004
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.1831077
Subject(s) - oled , encapsulation (networking) , materials science , optoelectronics , nanotechnology , computer science , layer (electronics) , computer network
We developed a hybrid encapsulation method for PM‐OLED consisting of SiN x , polymeric film and cover glass. The PM‐OLED encapsulated with the proposed layers shows the similar degradation in emission efficiency with the PM‐OLED with a metal cap. The proposed structure does not need to have desiccant inside so that thin‐film encapsulation of PM‐OLED is possible.