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P‐111: A Thin Film Encapsulation Stack for PLED and OLED Displays
Author(s) -
Assche F. J. H.,
Vangheluwe R. T.,
Maes J. W. C.,
Mischke W. S.,
Bijker M. D.,
Dings F. C.,
Evers M. F. J.,
Kessels W. M. M.,
Sanden M. C. M.
Publication year - 2004
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1889/1.1831072
Subject(s) - encapsulation (networking) , materials science , oled , thin film , permeation , optoelectronics , chemical engineering , nanotechnology , chemistry , layer (electronics) , computer science , computer network , biochemistry , membrane , engineering
For a thin film (< 1 μm) encapsulation stack consisting of only 3 plasma deposited silicon nitride layers separated by a thin (< 100 nm) organic layer, a water permeation rate of below 10 −5 g/m 2 per day at 50 °C and 50% rH has been measured using the Ca test. PLED lifetimes of over 500 hours at 60 °C and 90% rH have been reached locally. While the Ca test indicates that pinhole free encapsulation is possible, edge and particle related defects still forecast a challenge for device encapsulation.