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Mechanical properties and fracture analysis of glass substrate for PDPs
Author(s) -
Maeda Kei,
Nakao Yasumasa
Publication year - 2003
Publication title -
journal of the society for information display
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.578
H-Index - 52
eISSN - 1938-3657
pISSN - 1071-0922
DOI - 10.1889/1.1825678
Subject(s) - materials science , thermal shock , fracture (geology) , composite material , enhanced data rates for gsm evolution , substrate (aquarium) , stress (linguistics) , shock (circulatory) , thermal , computer science , medicine , telecommunications , linguistics , oceanography , philosophy , physics , meteorology , geology
— A thermal shock test was carried out using high‐strain‐point glass substrates for plasma‐display panels. From the fracture analysis, the fracture stress was determined and compared with the initial edge strength. It was observed that the edge strength greatly decreased because of micro cracks that formed on the glass surface during testing. Therefore, it is important to prevent the formation of micro cracks in order to avoid failure as well as to minimize thermal stress in the process. Fatigue is also an important parameter in preventing the failure of the glass substrate when the stress on it lasts for a long period of time.